WELCOME TO ROKKO
We are a precision engineering group principally engaged in the business of providing automated equipment and precision engineering services to our customers in the semiconductor and electronics industries. We design and manufacture proprietary semiconductor assembly equipment, lead frames and precision tooling for use in the semiconductor industry, as well as undertake precision stamping of connectors for use in the electronics industry.
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Latest News-
Visit us at Semicon Show SEA, 28 May – 30 May 2024 Venue: MITEC Kuala Lumpur. Booth No.: 1312 (Hall 2-4) Please click the following link for more information : Youtube https://youtu.be/VQhb9_FfuCc Please click the following link for more information : TikTok https://vt.tiktok.com/ZSY1tSGeP/
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Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “System and Method for Unloading IC Units” has been officially granted in Malaysia as Patent No. MY-200158-A. Malaysia Patent No.MY-200158-A will have a life of twenty years from the application […]
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Visit us at Semicon Show China, 20 Mar – 22 Mar 2024 Venue: Shanghai New International Expo Centre. Booth No.: N3753 Please click the following link for more information : Youtube https://youtu.be/NUchEBkOkmw Please click the following link for more information : TikTok https://vt.tiktok.com/ZSFDSph34/